JOB PURPOSE
We are looking for an experienced Mechanical Design Engineer with relevant FEA experience to support the development of advanced transceiver modules and sub-systems to meet our customers’ needs. The position involves both leading and supporting projects across various development phases, from concept definition to implementation into volume manufacturing. Knowledge of optical/micro-electronic modules/components will be a strong asset.
NATURE OF DUTIES/RESPONSIBILITIES
- Work within a multidisciplinary development team to provide mechanical design solutions and analysis solutions to meet design specifications. Design projects include, but are not limited to:
- Telecommunications transceivers and subsystems (TOSAs, ROSAs, etc).
- Microelectronic packages & multi chip modules (MCM)
- High speed RF applications.
- Fixturing design (or design oversight) to support product development and process engineering.
- Apply FEA and CFD analysis tools to evaluate linear and non-linear materials (parts and assemblies) in terms of predicting: stress states, fatigue, thermal behavior/performance, warpage/deformation, modal response, and combined thermal/stress/strain behavior.
- Define design concepts consistent with transceiver MSAs and microelectronic packaging requirements.
- Perform design risk assessments and define appropriate mitigations.
- Work with process and test engineering teams to ensure alignment of designs with process and test capabilities. Work with component suppliers to ensure design alignment to supplier manufacturing practices (DFM).
- Perform detailed statistical tolerance analysis of products and test fixturing/assembly tooling.
- Generate documentation including design specifications, part drawings, assembly drawings, Bill of Materials, common feature drawings and process flows.
- Support the definition and management of project plans to meet end deliverables and help coordinate activities within the multidisciplinary development team.
- Support prototype builds and engineering design verification to ensure compliance to requirements.
EDUCATION & EXPERIENCE
- Relevant engineering degree required with a minimum of 8 years of relevant design experience.
- Experience designing various transceiver pluggable modules (MSA compliant), such as QSFP-DD, SFF, OSEP, CFP, etc.
- Experience optimizing thermal-opto-mechanical-electrical layout and floor planning within tight space constraints (such as in a transceiver).
- Knowledge of high volume casting processes, materials, design limitations.
- Experience using 3D modeling tools (SolidWorks strongly preferred).
- Experience using (and validating results of) FEA and CFD analysis tools (ANSYS strongly preferred).
- Experience in optical and microelectronic technologies, materials, components, assembly and integration processes.
- Understanding of applicable material technologies including eutectic solders, adhesives and thermal interface materials.
- Experience in end-to-end product development, with product manufacturing implementation considered an asset.