Job Description
Our team has an immediate permanent opening for an Engineer.Responsibilities:Responsible for advancing packaging technology for RF System in Package(SIP) applications, including SMT, wirebonding, molding, solder ball attachment, strip grinding, and EMI shielding Create, conduct, and analyze Design of Experiments (DOE) for the purpose of developing and sustaining programs Responsible for collaborating with theengineering team in the development of new productsWhat you’ll bring to the team:PHD in Electrical/ElectronicEngineering with emphasis on RF and Microwave IC’sExperience with the RF circuit design process Understanding of allaspects of the hardware development cycle including requirements,architecture, simulation, schematic capture, PCB layout, power/thermaldesign, signal integrity, verification and manufacturing Good knowledge ofpackaging industry standards (IPC, JEDEC, IEEE, ISO, ANSI) Experiencewith AutoCad is desired, experience with Solidworks is an asset#J-18808-Ljbffr